|
|
Binary alloy with low
thermal expansion coefficient.
Used on:
Leadframes for integrated
circuits, thermostatic bi-metal strips and glass to metal seals. |
NOMINAL DATA SHEET
|
|
| Specific gravity |
8.12 |
| Density, lbs. per cu. in. |
0.293 |
| Electrical resistivity,
micro-ohm-cm |
72 |
|
|
|
Typical Tensile
Strength
(1,000 PSI)
|
| Annealed |
85,000 Max. |
| 1/4 Hard |
90,000 to 115,000 |
| 1/2 Hard |
105,000 to 125,000 |
| Hard |
120,000 Min. |
|
|
|
Typical Hardness,
Rockwell B
|
|
Annealed
|
70 Max.
|
|
1/4 Hard
|
78 to 83
|
|
1/2 Hard
|
84 to 88
|
|
|
|
|
| Ni |
39/41% |
| Cr |
0.05 |
| Mn |
0.60 |
| Si |
0.02 |
| C |
0.05 |
| Al |
0.02 |
| Co |
0.05 |
| P |
0.02 |
| S |
0.02 |
| Fe |
REMAINDER |
|
Note:
Nickel varies to achieve the proper thermal expansion.
|
TYPICAL
LINEAR COEFFICIENT OF THERMAL EXPANSION
(cm. per cm. C x 10 - 6) |
30 to 100 |
4.8 |
| 30 to 200 |
4.5 |
| 30 to 300 |
4.5 |
| 30 to 350 |
5.0 |
| 30 to 400 |
6.0 |
| 30 to 425 |
N/A |
| 30 to 450 |
7.0 |
| 30 to 500 |
8.0 |
| 30 to 550 |
8.8 |
| 30 to 600 |
9.5 |
| 30 to 700 |
10,.5 |
| 30 to 800 |
11.4 |
| 30 to 900 |
12.3 |
| 30 to 1000 |
13.2 |
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Disclaimer
Every effort is made to ensure that
technical specifications are accurate. However, technical specifications
included herein should be used as a guideline only. All specifications are
subject to change without notice.
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